MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517055609 A) filed by Kuraray Co. Ltd., Okayama, Japan, on June 9, for 'vapor deposition film, multilayer structure, packaging material, vacuum packaging bag and vacuum thermal insulation body.'
Inventor(s) include Nonaka Yasuhiro; Ishihara Hisashi; and Kataoka Naoki.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "The present invention provides: a vapor deposition film which is suppressed in decrease of gas barrier properties after bending and after storage; and a multilayer structure, a packaging material, a vacuum packaging bag and a vacuum ...