Intellectual Property India Publishes Patent Application for 'Vacuum-Based Clamping Device For 3d Surfaces And System Thereof' Filed by Thapar Institute Of Engineering & Technology

MUMBAI, India, July 11 -- Intellectual Property India has published a patent application (202511061436 A) filed by Thapar Institute Of Engineering & Technology, Patiala, Punjab, on June 27, for 'vacuum-based clamping device for 3d surfaces and system thereof.'

Inventor(s) include Anant Kumar Singh; and Ajay Berry.

The application for the patent was published on July 11, under issue no. 28/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a vacuum-based clamping device (100) and system (1000) for securing 3D surfaces and providing a reliable and precise method for holding complex 3D surfaces during finishing processes that includes a vacuum chamber (102), a centering clamp (104)...