MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517007589 A) filed by Dow Global Technologies Llc, Midland, U.S.A., on Jan. 29, for 'unimodal high density polyethylene for cap and closure devices.'
Inventor(s) include Zhang, Fengyi; Wu, Xiaosong; and Baillie, Rhett A.
The application for the patent was published on Feb. 21, under issue no. 08/2025.
According to the abstract released by the Intellectual Property India: "Embodiments of the present disclosure are directed towards unimodal high density polyethylene for cap and closure devices."
The patent application was internationally filed on Aug. 04, 2023, under International application No.PCT/US2023/029527.
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