MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202547059039 A) filed by Qualcomm Incorporated, San Diego, on June 19, for 'ultrasonic sensor system and multi-layer stiffener for foldable display.'
Inventor(s) include Tseng, Chin-Jen; Strohmann, Jessica Liu; Badge, Ila; Lin, Shiang-Chi; Yang, Min-Lun; and Panchawagh, Hrishikesh Vijaykumar.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "An apparatus includes an ultrasonic sensor stack, a foldable display stack that includes a display stiffener, and an additional stiffener between the ultrasonic sensor stack and the foldable display stack. The...