MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202347047132 A) filed by Henkel Ag & Co. Kgaa, Duesseldorf, Germany, on July 13, 2023, for 'two-part epoxy-based structural adhesive composition.'
Inventor(s) include Li, Bin; Qi, Yalong; Chen, Chunfu; Chu, Hongyu; and Lu, Daoqiang.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "Provided is a two-part epoxy-based structural adhesive composition, which comprises a first part and a second part. The first part comprises: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less than 400 g/eq, ii) a second aroma...