MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517049425 A) filed by Dai Nippon Printing Co. Ltd., Tokyo, on May 22, for 'through-hole electrode substrate and method for manufacturing through-hole electrode substrate.'
Inventor(s) include Suzuki Miyuki; Morii Akio; Yoshii Yumi; Arai Junko; Tsunoda Tsuyoshi; and Fujimoto Koji.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "This through-hole electrode substrate comprises: a substrate including a first surface and a second surface positioned on the opposite side from the first surface and having a through-hole penetrating from the first sur...