MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202547019039 A) filed by Qualcomm Incorporated, San Diego, on March 4, for 'three-dimensional object part segmentation using a machine learning model.'
Inventor(s) include Liu Minghua; Zhu Yinhao; Cai Hong; Porikli Fatih Murat; and Su Hao.
The application for the patent was published on March 14, under issue no. 11/2025.
According to the abstract released by the Intellectual Property India: "Systems and techniques are provided for part segmentation. For example, a process for performing part segmentation can include obtaining a three-dimensional capture of an object. The method can include generating one or more two-dimensional images of the object...