MUMBAI, India, May 2 -- Intellectual Property India has published a patent application (202517035198 A) filed by Dow Global Technologies Llc, Midland, U.S.A., on April 10, for 'three dimensional loop materials and uses thereof.'

Inventor(s) include Zhang Zheng; Ming Ming; Sun Yabin; Du Libo; Huang Xin; and Weng Xilun.

The application for the patent was published on May 2, under issue no. 18/2025.

According to the abstract released by the Intellectual Property India: "A three dimensional loop material made from a polyolefin resin composition having desirable cushioning and flame resistance properties for applications especially transportation industry. Also provided are methods of making the three dimensional loop material and products ma...