Intellectual Property India Publishes Patent Application for 'Thermoplastic Resin Composition And Molded Article' Filed by Techno-Umg Co. Ltd.

MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079243 A) filed by Techno-Umg Co. Ltd., Tokyo, on Aug. 21, for 'thermoplastic resin composition and molded article.'

Inventor(s) include Hayashi Ichiyo; and Shinohara Yoshiaki.

The application for the patent was published on Sept. 12, under issue no. 37/2025.

According to the abstract released by the Intellectual Property India: "A thermoplastic resin composition comprising a polycarbonate resin (A), a rubber-reinforced vinyl resin (B), a non-rubber-reinforced vinyl resin (C), and a lubricant (D), wherein the rubber-reinforced vinyl resin (B) contains at least an ethylene-(a-olefin) rubber-reinforced resin (B1) produced by the graft polymeriz...