MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517041818 A) filed by Lg Chem, Ltd., Seoul, Republic of Korea, on April 30, for 'thermoplastic resin composition, preparation method therefor, and molded article including same.'

Inventor(s) include Park, Chun Ho; Kim, Seo Hwa; Cho, Yun Kyoung; An, Yong Hee; Kim, Ho Hoon; Jang, Jeongmin; and Hwang, Hyeri.

The application for the patent was published on May 30, under issue no. 22/2025.

According to the abstract released by the Intellectual Property India: "The present disclosure relates to a thermoplastic resin composition, a method for preparing same, and a molded article including same and, more specifically, to a thermoplastic resin composition,...