MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517038992 A) filed by Lg Chem, Ltd., Seoul, Republic of Korea, on April 23, for 'thermoplastic resin composition, preparation method therefor, and molded article including same.'
Inventor(s) include Shim, Hyungseop; Yoo, Je Sun; Jang, Seokgoo; and Shin, Dong Kun.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a thermoplastic resin composition, a preparation method therefor, and a molded article including same. According to the present invention, replacement of conventional transparent ABS-based resins improves ...