Intellectual Property India Publishes Patent Application for 'Thermal Isolation Methodology For A Heat Sensitive Component Placed Within A Housing Of Electronic System' Filed by Sameer Centre For Electromagnetics, R&D Institution Under Ministry Of Electronics And Information Technology, Govt. Of India

MUMBAI, India, March 7 -- Intellectual Property India has published a patent application (202341058839 A) filed by Sameer Centre For Electromagnetics, R&D Institution Under Ministry Of Electronics And Information Technology, Govt. Of India, Chennai, Tamil Nadu, on Sept. 1, 2023, for 'thermal isolation methodology for a heat sensitive component placed within a housing of electronic system.'

Inventor(s) include Ghaffar, Abdul Latheef; and Palani Nainar.

The application for the patent was published on March 7, under issue no. 10/2025.

According to the abstract released by the Intellectual Property India: "The present disclosure envisages a thermal isolation methodology as a simplified design solution for a heat sensitive component placed wi...