MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202424038992 A) filed by Hyundai Mobis Co. Ltd., Seoul, Republic of Korea, on May 17, 2024, for 'terminal assembly.'
Inventor(s) include Kim, Dae Wook; Hwang, Seong Jun; and Park, Hyun Ho.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a terminal assembly, and more particularly, to a terminal assembly having improved coupling with an end coil. The terminal assembly of the present disclosure has the effect of enhancing space utilization by applying the terminal assembly to the side surface portion of the coil,...