Intellectual Property India Publishes Patent Application for 'System For Bonding Films And Method For Preparing Composite Film Using The Same' Filed by Prologium Technology Co. Ltd.

MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202414064969 A) filed by Prologium Technology Co. Ltd., Taoyuan City, Taiwan, on Aug. 28, 2024, for 'system for bonding films and method for preparing composite film using the same.'

Inventor(s) include Lin, Jhi-Jhong; Lin, Chia-Ming; and Kuo, Che-Ming.

The application for the patent was published on March 28, under issue no. 13/2025.

According to the abstract released by the Intellectual Property India: "A system for bonding films includes a first film (50), a second film (40) having a plurality of elements (41), a bonding roller (21), and a deformable roller (22) having a deformable outer layer (221). The stiffness of the second film (40) is less...