MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202517023587 A) filed by Daikin America, Inc; and Daikin Industries, Ltd., Orangeburg, U.S.A., on March 17, for 'system and method for forming wire and cable.'
Inventor(s) include Martin, Halie Jill; Orr, Matthew Philip; Wiekhorst, David J.; and Kenny, Robert David.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "A system and method for manufacturing wire and cable products with a polymer cable component is provided. The systems and methods include increasing the hardness of a polymer cable component in order to reduce compression and deformat...