Intellectual Property India Publishes Patent Application for 'Structural Part, Preparation Method For Structural Part And Electronic Device' Filed by Honor Device Co. Ltd.

MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202527079071 A) filed by Honor Device Co. Ltd., Guangdong, China, on Aug. 20, for 'structural part, preparation method for structural part and electronic device.'

Inventor(s) include Zhang, Hongming; Wang, Xiaoguang; Huo, Guoliang; Zhou, Qichen; Feng, Yu; and Zang, Yongqiang.

The application for the patent was published on Sept. 12, under issue no. 37/2025.

According to the abstract released by the Intellectual Property India: "Provided in the present application are a structural part, a preparation method for the structural part and an electronic device. The structural part comprises a base material and a metal coating layer, wherein the base mate...