MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547096976 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on Oct. 8, for 'stripline wafer for wafer based connector system.'
Inventor(s) include Walton, Scott Eric; Miller, Keith Edwin; Champion, Bruce Allen; Cina, Michael Frank; Rosenau, Joshua Allen; and Gingrich III, Charles Raymond.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "A multilayer stripline wafer for use in an electrical connector. The multilayer stripline wafer includes multiple layers. Signal transmission pathways are positioned on at least one interna...