MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202411018810 A) filed by Teerthanker Mahaveer University, Moradabad, Uttar Pradesh, on March 14, 2024, for 'soldering assistive device.'
Inventor(s) include Mayur Agarwal.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "A soldering assistive device, comprises a cylindrical shaped body 1 configured with a telescopic handle 2 for providing grip to the user, a laser sensor mapped on the body 1 for detecting size of the user's hands, an ultrasonic sensor mapped on the body 1 for detecting distance, an electromagnetic switch integrated within the b...