MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202517020693 A) filed by Senju Metal Industry Co. Ltd., Tokyo, on March 7, for 'solder alloy solder paste and solder joint.'
Inventor(s) include Yokoyama Takahiro; Yoshikawa Shunsaku; Iijima Yuki; Dei Kanta; Matsufuji Takahiro; Sugisawa Kota; and Suzuki Shigeto.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "Provided are a solder alloy a solder paste and a solder joint which exhibit a suitable melting temperature are excellent in terms of wettability have high tensile strength and shear strength and have excellent drop impact resistance. The ...