MUMBAI, India, Feb. 7 -- Intellectual Property India has published a patent application (202311051850 A) filed by John Verma, Chandigarh, India, on Aug. 2, 2023, for 'smart compaction module for iot based smart dustbin and method of working thereof.'
Inventor(s) include John Verma; and Dr. Ramkrishna Mitra.
The application for the patent was published on Feb. 7, under issue no. 06/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses compaction module to reduce volume of waste inside the bin. It consists of a drive screw 1041 provided at the End A of the frame which is driven with the help of a BLDC motor located at Frame for holding compaction module (103). A linear bearing 1043 an...