Intellectual Property India Publishes Patent Application for 'Sinter Ready Multilayer Wire/Ribbon Bond Pads And Method For Die Top Attachment' Filed by Alpha Assembly Solutions Inc.

MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202417068931 A) filed by Alpha Assembly Solutions Inc., Waterbury, U.S.A., on Sept. 12, 2024, for 'sinter ready multilayer wire/ribbon bond pads and method for die top attachment.'

Inventor(s) include Siebenhuhner, Matthew; Mo, Bin; Boureghda, Monnir; Fenech, Maurizio; Bankiewicz, Bogdan; Khaselev, Oscar; and Singh, Bawa.

The application for the patent was published on Jan. 31, under issue no. 05/2025.

According to the abstract released by the Intellectual Property India: "A method of manufacturing a bond pad for connecting a die to a copper ribbon or copper wire on a printed circuit board, the method comprising: providing a sheet of copper foil hav...