Intellectual Property India Publishes Patent Application for 'Shell Structure, Display Module, And Electronic Device' Filed by Honor Device Co. Ltd.

MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202517096622 A) filed by Honor Device Co. Ltd., Guangdong, China, on Oct. 7, for 'shell structure, display module, and electronic device.'

Inventor(s) include Miao, Dengkui; Xu, Wenbin; Wang, Wei; and Lai, Shunqi.

The application for the patent was published on Nov. 14, under issue no. 46/2025.

According to the abstract released by the Intellectual Property India: "The embodiments of the present application relate to the technical field of electronic devices. Provided are a shell structure, a display module, and an electronic device. The shell structure can improve the scratch resistance of cover plate glass, and when the shell structure is applied ...