MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202414079351 A) filed by Hayashi Telempu Corporation, Aichi, Japan, on Oct. 18, 2024, for 'sheet mechanism.'
Inventor(s) include Koji Yoshida; and Yuki Kashimoto.
The application for the patent was published on May 9, under issue no. 19/2025.
According to the abstract released by the Intellectual Property India: "[Problem] To provide a sheet mechanism that can suppress abnormal noise and rattling when a sheet material is wound and unwound, that does not require complicated steps for manufacturing a fixed shaft, and that can keep manufacturing costs low.[Solution] A sheet mechanism is provided that can suppress abnormal noise and rattling when a sheet ...