MUMBAI, India, March 7 -- Intellectual Property India has published a patent application (202311057880 A) filed by Honeywell International Inc., Charlotte, U.S.A., on Aug. 29, 2023, for 'sensor package.'
Inventor(s) include B, Manjesh Kumar; Dumpala, Basavaprashant; Sreeramu, Sudheer Beligere; and R, Gangaraju.
The application for the patent was published on March 7, under issue no. 10/2025.
According to the abstract released by the Intellectual Property India: "A sensor package is provided. The sensor package includes, but not limited to: a mounting adaptor defining a housing and a port channel connecting with the housing; a sensor assembly positioned in the housing and including a sensing element to sense an ambient environment; a pott...