Intellectual Property India Publishes Patent Application for 'Semiconductor Packages With Pre-Made Conductive Units And Panel-Level Methods Of Making The Same' Filed by Pep Innovation Pte. Ltd.

MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202424070902 A) filed by Pep Innovation Pte. Ltd., Singapore, on Sept. 19, 2024, for 'semiconductor packages with pre-made conductive units and panel-level methods of making the same.'

Inventor(s) include Chew, Hwee Seng.

The application for the patent was published on May 9, under issue no. 19/2025.

According to the abstract released by the Intellectual Property India: "The present application discloses a semiconductor package made from the first and second panel-level methods with at least one pre-made conductive unit. The semiconductor package includes one or more semiconductor dies, a molding layer for encapsulating the one or more semiconductor d...