Intellectual Property India Publishes Patent Application for 'Semiconductor Package With Local Interconnect And Chiplet Integration' Filed by Apple Inc.

MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202517014391 A) filed by Apple Inc., Cupertino, U.S.A., on Feb. 19, for 'semiconductor package with local interconnect and chiplet integration.'

Inventor(s) include Dabral, Sanjay; Zhai, Jun; Hu, Kunzhong; Jangam, Sivachandra; and Cao, Zhitao.

The application for the patent was published on March 14, under issue no. 11/2025.

According to the abstract released by the Intellectual Property India: "Semiconductor packages including local interconnects and methods of fabrication are described. In an embodiment, a local interconnect is fabricated with one or more cavities filled with a low-k material or air gap where a die-to-die routing path electricall...