Intellectual Property India Publishes Patent Application for 'Robust Ho Via SL Relays' Filed by Interdigital Patent Holdings, Inc.

MUMBAI, India, April 18 -- Intellectual Property India has published a patent application (202517026989 A) filed by Interdigital Patent Holdings, Inc., Wilmington, U.S.A., on March 24, for 'robust ho via sl relays.'

Inventor(s) include Teyeb, Oumer; Freda, Martino, M.; Hoang, Tuong, Duc; and Kini, Ananth.

The application for the patent was published on April 18, under issue no. 16/2025.

According to the abstract released by the Intellectual Property India: "Systems, methods, and instrumentalities are disclosed herein associated with robust handover (HO) via sidelink (SL) relays. A remote wireless transmit/receive unit (WTRU) may be used in HO scenario from a source network node (e.g., gNB) to a neighbor or target network node (e.g., gNB)...