MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202417070558 A) filed by Sumitomo Bakelite Co. Ltd., Tokyo, on Sept. 18, 2024, for 'resin composition for encapsulation and method for producing single-sided-encapsulation structure.'
Inventor(s) include Matsuo Makoto.
The application for the patent was published on Jan. 31, under issue no. 05/2025.
According to the abstract released by the Intellectual Property India: "This resin composition for encapsulation is used to produce a single-sided-encapsulation-type structure by single-sided encapsulation of a mother board on which at least one electronic device is mounted. This resin composition for encapsulation comprises a trifunctional or higher epo...