MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051278 A) filed by Prime Polymer Co. Ltd., Tokyo, on May 28, for 'resin composition, multilayer body and packaging material.'
Inventor(s) include Fujii Sumiaki; Saito Tetsuya; Oguni Michihiko; Yoshidome Ken; and Suzuki Masao.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "[Problem] To provide a resin composition which is capable of constituting a multilayer body that has excellent extrusion lamination processability, heat resistance and flexibility, and the like. [Solution] A resin composition which contains the four components described ...