MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517046900 A) filed by Namics Corporation, Niigata, Japan, on May 15, for 'resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic component.'
Inventor(s) include Meguro Kento; and Saito Atsushi.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive. Provided is a resin composition comprising: (A) a ...