MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202517038229 A) filed by Brook & Whittle Limited, Amherst, U.S.A., on April 21, for 'recyclable light blocking film with perforations.'
Inventor(s) include Sharp, Andrew; and Morgan, Mitchell J.
The application for the patent was published on May 9, under issue no. 19/2025.
According to the abstract released by the Intellectual Property India: "A recyclable shrink label includes a heat shrink film having a first surface and a second surface opposite of the first surface; a light blocking layer disposed adjacent the first surface and comprising a light blocking component; and a plurality of perforations extending through the thickness of the heat shrin...