MUMBAI, India, April 25 -- Intellectual Property India has published a patent application (202517033927 A) filed by Techno Umg Co. Ltd., Tokyo, on April 7, for 'rattle noise reduction material and thermoplastic resin composition.'
Inventor(s) include Hiraishi Kentaro; Maruyama Taichi; and Kitaguchi Hironori.
The application for the patent was published on April 25, under issue no. 17/2025.
According to the abstract released by the Intellectual Property India: "Provided is a rattle noise reduction material comprising a (meth)acrylic ester based polymer (B) which has: a polymer (b1) that includes a structural unit derived from an acrylic ester compound and a structural unit derived from a methacrylic ester compound and that has a glass tra...