Intellectual Property India Publishes Patent Application for 'Quick Release End Point Attachment' Filed by Columbus Mckinnon Corporation

MUMBAI, India, April 25 -- Intellectual Property India has published a patent application (202414077290 A) filed by Columbus Mckinnon Corporation, Getzville, U.S.A., on Oct. 11, 2024, for 'quick release end point attachment.'

Inventor(s) include Jared Benjamin Godbey.

The application for the patent was published on April 25, under issue no. 17/2025.

According to the abstract released by the Intellectual Property India: "A quick release end point attachment assembly for connecting to a material handling device such as a hoist or the like. A first shaft may be provided with external threads for engaging with the material handling device. A second shaft extends downward from the bottom of the assembly and may be configured to support suspen...