Intellectual Property India Publishes Patent Application for 'Polypropylene Blends For Thermoforming' Filed by Amcor Flexibles North America, Inc.

MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517046976 A) filed by Amcor Flexibles North America, Inc., Neenah, U.S.A., on May 15, for 'polypropylene blends for thermoforming.'

Inventor(s) include Theobald, Tyler, J.; Priscal, Michael, D.; Nelson, Kevin, P.; and Liu, Yuan.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "A thermoformable polymeric film includes a polymeric layer. The polymeric layer includes at least 50% polypropylene by weight, at least 5% tackifier by weight, and from 0.1% to 5% crosslinker by weight. The polypropylene comprises impact polypropylene. The layer comprises ...