Intellectual Property India Publishes Patent Application for 'Polyimide Varnish For Coating Conductor With Improved Heat Dissipation For Coating Conductor And Polyimide Coating Material Comprising The Same' Filed by Pi Advanced Materials Co. Ltd.

MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517046173 A) filed by Pi Advanced Materials Co. Ltd., Chungcheongbuk, Republic of Korea, on May 14, for 'polyimide varnish for coating conductor with improved heat dissipation for coating conductor and polyimide coating material comprising the same.'

Inventor(s) include Moon, Gyeongmin; Ro, Gyeonghyeon; and Lee, Ik Sang.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "Provided is polyimide varnish comprising: a polyamic acid solution containing diamine monomer and dianhydride monomer as polymerized units; an additive containing boron nitride; a...