MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517049161 A) filed by Basf Se, Ludwigshafen Am Rhein, Germany, on May 21, for 'polyamide foams with high thermal stability.'
Inventor(s) include Spies, Patrick; Longo-Schedel, Daniela; Keller, Angelika; and Cremer, Jens.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to polyamide foam particles comprising (A) from 5 to 99.9 wt.-% of at least one polyamide, (B) from 0.1 to 5 wt.-% of at least one stabilizer, selected from secondary arylamines (C) from 0 to 49 wt.-% of further additives, wherein the sum of the com...