MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202411004741 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Jan. 23, 2024, for 'plant budding device.'
Inventor(s) include Reshu Rajput.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A plant budding device, comprising a pair of semi-circular bodies 1 constructed with a set of curved-shaped plates 2, a camera 3 installed with one of bodies 1 via a link 4 for capturing multiple images of stem, multiple motorized hinges 5 configured between plates 2 to tilt plates 2 towards/away from...