MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202517093573 A) filed by Dow Global Technologies Llc, Midland, U.S.A., on Sept. 29, for 'photovoltaic encapsulation film composition with anti-pid performance.'
Inventor(s) include Sun, Yabin; Zhang, Wenxin; Li, Yuyan; and Habersberger, Brian M.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "This disclosure is directed to novel encapsulant film compositions that provide anti-PID properties while maintaining good performance for curing, adhesion, volume resistivity. The compositions comprise of: a) a polyolefin polymer; b) an organic peroxide; c...