MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202514003245 A) filed by Triple Win Technology Co. Ltd., Shenzhen, China, on Jan. 14, for 'photoelectric packaging structure, preparation method and camera module.'
Inventor(s) include Hsin-Yen Hsu; and Tzu-Li Feng.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A packaging structure, a preparation method, and a camera module are provided. The packaging structure includes a substrate module, and a light emitting unit and a light receiving unit located on the substrate of the substrate module. The substrate module defines first channels and seco...