MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202414092672 A) filed by Kohler (China) Investment Co. Ltd., Shanghai, on Nov. 27, 2024, for 'panel assembly.'
Inventor(s) include Bin Guo.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "A panel assembly includes a panel mounting frame; a panel cover; and a hinge configured to connect the panel cover to the panel mounting frame. The hinge includes a hinge plate; a first pivot shaft disposed on a first side of the hinge plate and configured to be pivotally connected to the panel mounting frame; and a second pivot shaft disposed on a second side of...