Intellectual Property India Publishes Patent Application for 'Packaging Structure And Preparing Method Thereof' Filed by Triple Win Technology (SHENZHEN) Co. Ltd.

MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202514002979 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on Jan. 13, for 'packaging structure and preparing method thereof.'

Inventor(s) include Hung-Ta Li.

The application for the patent was published on July 25, under issue no. 30/2025.

According to the abstract released by the Intellectual Property India: "A packaging structure and a preparing method are provided. The structure includes a first packaging body, a second packaging body, a first component embedded in the first packaging body, and a second component embedded in the second packaging body. The first packaging body includes a first surface and a second surfac...