MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202424062623 A) filed by Leef Blattwerk Gmbh, Potsdam, Germany, on Aug. 19, 2024, for 'packaging for an article and a packaged article.'
Inventor(s) include Claudio Fritz-Vietta.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The disclosure relates to a three-dimensionally shaped packing bottom (1) of a leaf material of a plant, the packing bottom (1) being adapted to receive an article to be packaged and comprising: a bottom support surface (2), a bottom side wall (3) surrounding the bottom support surface (2), and a bottom edge (4) arranged at ...