Intellectual Property India Publishes Patent Application for 'Package Substrate Comprising At Least Two Core Layers' Filed by Qualcomm Incorporated

MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202547067916 A) filed by Qualcomm Incorporated, San Diego, on July 16, for 'package substrate comprising at least two core layers.'

Inventor(s) include We, Hong Bok; Buot, Joan Rey Villarba; and Kim, Michelle Yejin.

The application for the patent was published on July 25, under issue no. 30/2025.

According to the abstract released by the Intellectual Property India: "A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes (i) a first cored substrate portion comprising a first core layer comprising a first cavity, a first integrated device located in the first cavity of the first core layer, and a fi...