Intellectual Property India Publishes Patent Application for 'Package Structure Of Optical Emission Module And Preparation Method' Filed by Triple Win Technology Co. Ltd.

MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202514003021 A) filed by Triple Win Technology Co. Ltd., Shenzhen, China, on Jan. 13, for 'package structure of optical emission module and preparation method.'

Inventor(s) include Hsin-Yen Hsu; and Tzu-Li Feng.

The application for the patent was published on July 25, under issue no. 30/2025.

According to the abstract released by the Intellectual Property India: "A package structure of an optical emission module and a preparation method thereof are provided. The package structure includes a substrate module and an optical emission module. The substrate module includes a substrate, and multiple channels are defined in the substrate module. The optica...