Intellectual Property India Publishes Patent Application for 'Package Comprising A Package Substrate That Includes An Encapsulated Portion With Interconnection Portion Blocks' Filed by Qualcomm Incorporated

MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202547079722 A) filed by Qualcomm Incorporated, San Diego, on Aug. 22, for 'package comprising a package substrate that includes an encapsulated portion with interconnection portion blocks.'

Inventor(s) include Patil, Aniket; We, Hong Bok; and Buot, Joan Rey Villarba.

The application for the patent was published on Sept. 12, under issue no. 37/2025.

According to the abstract released by the Intellectual Property India: "A package comprising a package substrate and a first integrated device coupled to the package substrate through a first plurality of solder interconnects. The package substrate comprises a bridge and/or an interposer, an encapsulate...