Intellectual Property India Publishes Patent Application for 'Package Comprising A Lid Structure With A Compartment And Method For Fabricating The Package' Filed by Qualcomm Incorporated

MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202547034790 A) filed by Qualcomm Incorporated, San Diego, on April 9, for 'package comprising a lid structure with a compartment and method for fabricating the package.'

Inventor(s) include Yu Youmin; Wu Wei; Xu Guoping; and Nikfar Nader.

The application for the patent was published on May 9, under issue no. 19/2025.

According to the abstract released by the Intellectual Property India: "A package comprising a substrate a first integrated device coupled to a first surface of the substrate a lid structure coupled to the substrate where the lid structure includes a first compartment comprising a side surface and an inner top surface and a thermal inter...