MUMBAI, India, May 16 -- Intellectual Property India has published a patent application (202517039089 A) filed by Dai Nippon Printing Co. Ltd., Tokyo, on April 23, for 'outer packaging material for vacuum thermal insulation materials, vacuum thermal insulation material, and article with vacuum thermal insulation material.'

Inventor(s) include Muneda, Taku; and Mizoshiri, Makoto.

The application for the patent was published on May 16, under issue no. 20/2025.

According to the abstract released by the Intellectual Property India: "The present disclosure provides an outer packaging material for vacuum thermal insulation materials, the outer packaging material comprising a film that has a base material which comprises a polyethylene terephth...