Intellectual Property India Publishes Patent Application for 'Optical Fiber Connector With An Integrated Sealing Screw And Crimp Band' Filed by Sterlite Technologies Limited; and Anycom Technology (HK) Co. Ltd.

MUMBAI, India, April 4 -- Intellectual Property India has published a patent application (202311065682 A) filed by Sterlite Technologies Limited; and Anycom Technology (HK) Co. Ltd., Gurugram, Haryana, on Sept. 29, 2023, for 'optical fiber connector with an integrated sealing screw and crimp band.'

Inventor(s) include Wayne Wang; Ajayakumar Gopi; and Arjun Vinod.

The application for the patent was published on April 4, under issue no. 14/2025.

According to the abstract released by the Intellectual Property India: "Disclosed is an optical fiber connector (100) having a connector assembly (108), a connector body (110), an outer housing (202), and an integrated metallic sealing unit (206). The connector assembly (108) has a ferrule (112) ar...