MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202517094287 A) filed by Kuraray Co. Ltd., Okayama, Japan, on Sept. 30, for 'multilayer structure, roll-shaped structure, and packaging material.'
Inventor(s) include Morikawa Keisuke; and Taoka Yuta.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "This invention provides: a multilayer structure and a roll-shaped structure, for which adhesion of a pigment to a resin layer is reduced and which have good barrier properties; and a packaging material comprising such a multilayer structure. This multilayer structure has a paper substrate, a layer A l...