Intellectual Property India Publishes Patent Application for 'Multilayer Metallized Paper-Based Packaging Material' Filed by Societe Des Produits Nestle S. A.

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517040759 A) filed by Societe Des Produits Nestle S. A., Vevey, Switzerland, on April 28, for 'multilayer metallized paper-based packaging material.'

Inventor(s) include Mora, Federico; and Darra, Matteo Riccardo.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a cellulosic substrate comprising or consisting of a cellulose graft copolymer comprising polypeptide branches. The present invention also relates to a packaging material comprising at least one paper layer comprising or consisting of a cellulose graft ...